IBM Systems has openings for interns as development engineers to support our hardware and semiconductor products. We develop industry-leading hardware for IBM Systems, storage, and related products, including OpenPOWER and System Z enterprise systems. Development engineers participate in various aspects of the development and test process, such as: semiconductor packaging development, microprocessor characterization, memory subsystem design, microprocessor design for test, post-silicon validation, simulation modeling, and product engineering. We are seeking a qualified intern to support microelectronic packaging bond and assembly (BA) processes to enable next generation product technologies. The candidate must be able to develop new processes and work with new materials to enable IBM’s technology roadmap. Candidates with at least three to six months of team based work experience with hardware products are preferred but not required. The successful candidate should have experience related to a 4-year engineering degree, preferably in materials, mechanical, chemical, and/or industrial engineering disciplines. Advanced technical degrees also desired, including M.S. and Ph.D. level candidates. Position available in Hopewell Junction, NY.
High School Diploma/GED